FT thermal management products are based on a simple premise:
We convert power electronic packaging into surface-mount applications.
Our very thin, all-polyimide TPI bond film --only 1.3 mils thick-- is used to heat-seal the solderable surface to the heat sink. The bond is extremely durable: it can operate continuously at 250oC+, and can survive exposure up to 350oC+. The dielectric strength of TPI bond film is over 4000 volts.
NOTE:
* All downloadable files are in Adobe Acrobat PDF format (except where noted).
* US patents and patents pending apply to these products.
* POWERSITE, POWERFLEX, POWERVIA and CUPRIMIDE are trademarked.
TECHNICAL INFORMATION (downloadable PDF files)
THERMAL TRANSFER COMPARISON STUDY -- TO-220 and TO-247 devices tested on PowerSites (laminated copper), various insulation pad materials and IMS. Die temperature accurately measured with an Anatech pulse machine.
ENVIRONMENTAL STRESS STUDY -- before-and-after thermal transfer measurements of PowerSite subassemblies (TO-220 on aluminum plate) with exposure to thermal shock, thermal cycling, thermal aging and 85oC/85% humidity. (Measurements done with Anatech machine.)
POWERSITE OEM APPLICATION SURVEY
Is Powersite technology a good fit for your application?
POWERVIA OEM APPLICATION SURVEY
Is PowerVia technology a good fit for your application?
'ALL-POLYIMIDE THERMAL INTERFACE SYSTEMS' -- presented at June 2003 SMTA 'Harsh Environment' workshop in Dearborn, MI. (Large PDF file: 2 Mb.)
'SOLID-METAL THERMAL COLUMNS IN CONVENTIONAL PCBs' (PowerVia technology) -- presented at September 2003 annual SMTA Conference in Rosemount, IL. (Large PDF file: 1Mb.)
'FLEXIBLE THERMAL MANAGEMENT CIRCUITS BONDED DIRECTLY TO ALUMINUM HEAT SINKS' (PowerFlex technology) -- presented at October 2003 IMAPS Thermal Management Workshop in Palo Alto, CA. [Links to both the PowerFlex technical paper and presentation are given.]
POWERSITE AUTOMATION -- the unique thermoplastic polyimide adhesive system of our TPI film allows the picking-and-placing of PowerSites onto hot heat sinks. This facilitates simple automation for cost-effective single-unit production -- this short video demonstrates the precise placement of the TPI and copper patches by our PowerSite 'High-Volume Machine' (HVM); after this process, the subassembly goes into a platen press for full-bonding.
(Large MPG file: 1.4Mb.)
'COOLBLUE' PHASE-CHANGE MATERIAL -- excellent thermal performance interface material in easy-to-apply, cost-effective 'crayon' format. (Under development.)
SURFACE-MOUNTING OF POWER DEVICES TO ALUMINUM HEAT SINKS -- presented at February 2004 SMTA PanPacific conference in Kahuku, HI. [Links to both the technical paper and presentation are given.]
TPI BOND FILM DURABILITY -- the all-polyimide TPI bond film maintains its integrity --ensuring thermal transfer-- in harsh environmental conditions. (PDF file)
