FT thermal management products are based on a simple premise: We convert power electronic packaging into surface-mount applications. Our very thin, all-polyimide TPI bond film --only 1.3 mils thick-- is used to heat-seal the solderable surface to the heat sink. The bond is extremely durable: it can operate continuously at 200oC, and can survive exposure up to 310oC. The dielectric strength of TPI bond film is over 4000 volts. |
POWERSITE pads allow the soldering of power devices directly to aluminum heat sinks. Attachment hardware is eliminated. Thermal transfer is maximized: expect an improvement of about 2oC/W for a TO-220 and 1oC/W for a TO-247 (vs alumina-filled insulator pads). |
POWERFLEX printed circuits are heat-sealed directly to heat sinks -- no attachment hardware is required. Thermal performance is competitive with IMS and DBC, but cost is lower and design flexibility is greatly enhanced. |
POWERVIA columns provide a solid-metal pathway from a PCB surface-mounted power device and an aluminum heat sink. Their thermal transfer is much higher than conventional plated-thru holes + insulation pad, and pressure-dependency is eliminated. |
FRAIVILLIG TECHNOLOGIES has other high-performance products under development (including the substrate-less CuprImide product above, which offers excellent circuit thermal transfer at low cost). We would like to discuss your application demands and requirements. |
Our Products |
NOTE: * All downloadable files are in Adobe Acrobat PDF format. * US patents and patents pending apply to these products. * POWERSITE, POWERFLEX, POWERVIA and CUPRIMIDE are trademarked. |
Fraivillig Technologies Next-Generation Thermal Management |
