Fraivillig Technologies Next-Generation Thermal Management

High-performance insulation systems: *  All-polyimide constructions *  Durable dielectric layer *  High thermal transfer *  Hardware-free

EVOLUTION  OF          THERMAL INTERFACE TECHNOLOGY                                    Discrete power devices:                               Mica+grease                        1940s                               Insulator pads                      1960s                               PowerSite* pads                 2000                               PowerVia* columns           2002                                         Power circuitry:                               Ceramic                               1960s                               Insulated metal                    1980s                               PowerFlex* circuits           2002                                                                       * Trademarks of Fraivillig Technologies  (patents and patents pending)

Are you ready for 'Next-Generation' thermal management?  Take advantage of today's market turbulence to gain sustainable advantage.  Fraivillig Technologies has products and capabilities that can improve the performance and/or lower the cost of your products for power conversion, motion+motor control, automotive and other thermally-demanding applications.

"thermal management" "power electronics" TO-220 TO-247 Bergquist Chomerics PowerSite PowerVia PowerFlex EIS Fabrico IMS DBC Sil-Pad Cho-Therm "power device" "heat sink" polyimide "thermal via" "power converter" "Union Bridge" "thermal transfer" "electronic cooling" 'thermal interface" "thermal resistance" "thermal impedance" "power device" Denka Thermagon